Diamond Tools

Home > Product > Diamond Wire Saw

0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

Xiamen ZL Diamond Technology Co., Ltd.
  • Application：Stone, Glass,Ceramic etc
  • Type：Electroplating
  • MOQ：1 Roll
  • Custom：Accept
  • Usage：Wet & Dry Working
  • Grit：200#

Base Info

  • Model NO.：ZL-DX
  • Total Lengh：65 Meter,Roll
  • Transport Package：White Box+Carton
  • Specification：0.3mm 0.4mm 0.45mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm a
  • Trademark：ZLION
  • Origin：Xiamen, China
  • HS Code：82029910
  • Production Capacity：10000 Roll,Month

Description

1.Durable, Strong tensile strength
2.Small diameter, small cutting seam
3.Can be made as long as 200 meters  0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting