Resin Bond Diamond Back Grinding Wheels for Silicon Wafer Thinning
More SuperHard Products Co., Ltd.Base Info
- Model NO.：Requirements
- Manufacturing Process：Sintered
- Shape：Cylindrical
- Bonding Agent：Resin
- Abrasive：Diamond
- Application：Silicon Wafer Thinning
- Trademark：Moresuperhard
- Transport Package：Carton Box
- Specification：Requirements
- Origin：China
- HS Code：8207901000
Description