10mm Resin Diamond Polishing Pads for Dry Grinding Dongguan Merrock Industry Co., Ltd. Base Info Manufacturing Process：Hot PressShape：CircleBonding Agent：ResinTrademark：MRKTransport Package：CartonSpecification：4 inchOrigin：China Description Pre：0.34mm Diamond Wire Saw for Silicon Sapphire Bricking/Cropping/Squaring Next：4 Inch Diamond Blades for Floor Grinding
