Metal Bond Cutting Blade for Wafering and Dicing
Zhengzhou Research Institute for Abrasives & GrindingBase Info
- Kind：Diamond Wheel
- Manufacturing Arts：Sinter
- Usage：Stone Cutting, Drilling, Engineering Material, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Fire-Retardant, Porcelain, Plastics, Laminate Plate
- Saw Blade External Diameter：150mm
Description
- Pre：TCT Saw Blade
- Next：Flat PCD Insert